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SINGLE CHANNEL MICROCOUPLERTM FODB100
DESCRIPTION
The FODB100, FODB101 and FODB102 single channel MICROCOUPLERSTM are all Pb-free, low profile miniature surface mount optocouplers in a Ball Grid Array (BGA) package. Each consists of an aluminum gallium arsenide (AlGaAs) infrared emitting diode driving a silicon phototransistor.
FODB101
FODB102
FEATURES
* Low profile package (1.20mm maximum mounted height) * Land pattern allows for optimum board space savings * High Current Transfer Ratio (CTR) at low IF * Minimum isolation distance of 0.45mm * High steady state isolation voltage of 2500Vrms * Data rates up to 120Kbit/s (NRZ) * Minimum creepage distance of 2mm * Wide operating temperature range of -40C to +125C * Available in tape and reel quantities of 3000 units * Applicable to Pb-free Infrared Ray reflow (260C max) * UL, C-UL approved; VDE pending
SCHEMATIC
ANODE 1 4 COLLECTOR
CATHODE 2
3 EMITTER
APPLICATIONS
* Primarily suited for DC-DC converters * For ground loop isolation, signal to noise isolation Communications - chargers, adapters Consumer - appliances, set top boxes Industrial - power supplies, motor control
PACKAGE DIMENSIONS
3.50 0.10 2.50 1 2 4 3 B A 0.65 MAX
2.50 BALL #1 INDICATOR
3.50 0.10
(O2.30)
4 BOTTOM VIEW
3
0.98 MAX O 0.80 MIN 0.10 C B A
1 TOP VIEW
2 0.35 MAX 0.25 MIN
1.20 MAX
0.85 MAX 0.68 MIN SEATING PLANE
NOTES: UNLESS OTHERWISE SPECIFIED A) ALL DIMENSIONS ARE IN MILLIMETERS. B) NO JEDEC REGISTRATION REFERENCE AS OF NOVEMBER 2002.
C
0.10 C
(c) 2004 Fairchild Semiconductor Corporation
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SINGLE CHANNEL MICROCOUPLERTM FODB100
Parameter TOTAL PACKAGE Storage Temperature Operating Temperature Junction Temperature EMITTER Continuous Forward Current Reverse Input Voltage Power Dissipation Derate linearly (above 25C) DETECTOR Continuous Collector Current Power Dissipation Derate linearly (above 25C) Collector-Emitter Voltage Emitter-Collector Voltage IF (avg) VR PD 30 6 40 0.39 50 150 1.42 75 7 mA V mW mW/C mA mW mW/C V V
FODB101
Symbol TSTG TOPR Tj Value -55 to +150 -40 to +125 130
FODB102
Units C C C
ABSOLUTE MAXIMUM RATINGS (TA = 25C unless otherwise specified)
PD VCEO VECO
ELECTRICAL CHARACTERISTICS (TA = 25C) INDIVIDUAL COMPONENT CHARACTERISTICS
Parameter EMITTER Forward Voltage Reverse Current DETECTOR Breakdown Voltage Collector to Emitter Emitter to Collector Collector Dark Current Capacitance (IC = 100 A, IF = 0) (IE = 100 A, IF = 0) (VCE = 75 V, IF = 0) (VCE = 0 V, f = 1 MHz) BVCEO BVECO ICEO CCE 8 75 7 100 nA pF V (IF = 2 mA) (VR = 6 V) VF IR 1.0 1.5 10 V A Test Conditions Symbol Min Typ** Max Unit
(c) 2004 Fairchild Semiconductor Corporation
Page 2 of 8
8/19/04
SINGLE CHANNEL MICROCOUPLERTM FODB100 FODB101 FODB102
TRANSFER CHARACTERISTICS (TA = 25C)
Characteristic Current Transfer Ratio1 Saturated Current Transfer Ratio (Collector to Emitter) Saturation Voltage Test Conditions (IF = 1 mA, VCE = 5 V) (IF = 1.6 mA, VCE = 0.4 V) (IF = 1.0 mA, VCE = 0.4 V) (IF = 3.0 mA, IC = 1.8 mA) (IF = 1.6 mA, IC = 1.6 mA) (IC = 2 mA, VCE = 5 V) (RL = 1K) (IC = 2 mA, VCE = 5 V) (RL = 1K) IF = 1.6 mA, VCC = 5.0 V RL = 750 IF = 1.6 mA, VCC = 5.0 V RL = 4.7K IF = 1.6 mA, VCC = 5.0 V RL = 750 IF = 1.6 mA, VCC = 5.0 V RL = 4.7K Symbol CTR CTRCE(SAT) Min 100 100 75 0.4 % Typ** Max Unit %
VCE (SAT) tr tf 1
V
Rise Time (Non-Saturated) Fall Time (Non-Saturated)
s 5 3 TPHL 12 5 TPLH 19 s s
Propagation Delay High to Low
Propagation Delay Low to High
ISOLATION CHARACTERISTICS
Characteristic Steady State Isolation Voltage2 Resistance (input to output)2 Capacitance (input to output)2 Test Conditions (RH 50%, TA = 25C, t = 1 sec) (VI-O = 500VDC) f = 1MHz Symbol VISO RISO CISO Min 2500 1012 0.3 0.5 Typ** Max Unit V(rms) pF
Notes: 1. CTR bin (FODB100 only) FODB101: 100% - 200% FODB102: 150% - 300% 2. Pin 1 and Pin 2 are shorted as input and Pin 3 and Pin 4 are shorted as output.
(c) 2004 Fairchild Semiconductor Corporation
Page 3 of 8
8/19/04
SINGLE CHANNEL MICROCOUPLERTM FODB100
TYPICAL PERFORMANCE CURVES
Fig. 1 Normalized CTR vs. Temperature (VCE = 2V) Normalized CTR @ 25C
IF = 2mA @ VCE = 2V
FODB101
FODB102
Fig. 2 Normalized CTR vs. Temperature (VCE = 5V) Normalized CTR @ 25C 1.2
IF = 2mA @ VCE = 5V
1.2 1 0.8 0.6 0.4 0.2 0 25 40 60 80 100 Temperature (C) 120 140
IF = 500A @ VCE = 2V IF = 1mA @ VCE = 2V
1 0.8 0.6 0.4 0.2 0 25 40
IF = 500A @ VCE = 5V
IF = 1mA @ VCE = 5V
60 80 100 Temperature (C)
120
140
Fig. 3 Current Transfer Ratio vs. Collector to Emitter Voltage 500 400 CTR (%) 300 200 100 0 0 2 4 VCE (V) 6 8 10
2mA 1mA
Fig. 4 Current Transfer Ratio vs. Collector Saturation Voltage 350 300 250 CTR (%) 200 150 100 50 0 0 0.8 0.2 0.4 0.6 Collector Saturation Voltage (V) 1.0
2mA 1mA 500A
500A
Fig. 5 Baud Rate vs. Load Resistor 200 Baud Rate - Kbit/s 150 100 Vcc = 12V 50 Vcc = 5V 0 200 400 600 800 1000 1200 1400 RL - Load Resistor - Ohms 1600 IF = 1.47 mA Ta = 23C, PRSG = (28-1) BER < 10-6
(c) 2004 Fairchild Semiconductor Corporation
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SINGLE CHANNEL MICROCOUPLERTM FODB100
TAPE AND REEL SPECIFICATIONS
Embossed Carrier Tape Configuration
P0 T E1 D0
FODB101
FODB102
F K0 Wc B0 E2 W
Tc A0 P1 D1
User Direction of Feed
Dimensions are in millimeter
Pkg type Optocoupler (12mm) A0 3.80 0.10 B0 3.80 0.10 W 12.0 +0.3/ -0.1 D0 1.50 +0.25/ -0.00 D1 1.50 +0.25/ -0.00 E1 1.75 0.10 E2 10.25 min F 5.50 0.05 P1 8.0 0.1 P0 4.0 0.1 K0 1.40 0.10 T 0.279 0.02 Wc 9.2 0.3 Tc 0.06 0.02
Notes: A0, B0, and K0 dimensions are determined with respect to the EIA/Jedec RS-481 rotational and lateral movement requirements (see sketches A, B, and C).
20 deg maximum Typical component cavity center line
0.5mm maximum
B0 20 deg maximum component rotation
0.5mm maximum
Sketch A (Side or Front Sectional View)
Typical component center line A0 Sketch B (Top View)
Sketch C (Top View)
Component Rotation
Component lateral movement
Component Rotation
Optocoupler Reel Configuration
W1 Measured at Hub
B Min Dim C
Dim D min Dim A max Dim N
DETAIL AA
See detail AA W3
13" Diameter Reel
W2 max Measured at Hub
Dimension are in inches and millimeters
Tape Size 12mm Reel Option 13" Dia Dim A 13.00 330 Dim B 0.059 1.5 Dim C 512 +0.020/-0.008 13 +0.5/-0.2 Dim D 0.795 20.2 Dim N 7.00 178 Dim W1 0.488 +0.078/-0.000 12.4 +2/-0 Dim W2 0.724 18.4 Dim W3 (LSL-USL) 0.469 - 0.606 11.9 - 15.4
(c) 2004 Fairchild Semiconductor Corporation
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SINGLE CHANNEL MICROCOUPLERTM FODB100
MARKING INFORMATION
4
1 3 4
FODB101
FODB102
3
5
Definitions
1 2 6 3 4 5 6 7 Fairchild logo Device number (FODB100) One digit year code e.g. "4" for 2004 6-week date code character Die Run Code Assembly package code VDE 0884 approved (Optional)
X Y TT
B100 C V
1
2 7
2
Ball #1 Indicator
Note: The device number prefix of "FOD" will be ommitted in the part number
RECOMMENDED FOOTPRINT DRAWING FOR PCB LAYOUT
O0.65 4 3
2.50
1
2.50
2
Note: 1. All dimensions in millimeters (mm) 2. It is recommended to use 6 mils of stencil thickness on PCB
(c) 2004 Fairchild Semiconductor Corporation
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8/19/04
SINGLE CHANNEL MICROCOUPLERTM FODB100 FODB101 FODB102
RECOMMENDED INFRARED REFLOW SOLDERING PROFILE
Entrance 270.00 236.25
Zone 1
Zone 2
Zone 3
Zone 4
Zone 5
Cooling
Temperature (C)
202.50 168.75 135.00 101.25 67.50 33.75 0.00 0.66 1.31 1.97 2.63 3.28 3.94 4.60 5.26 5.91 6.57 7.23 7.88
Time (min.)
Reflow Profile for Pb Free Convection Reflow Average ramp-up rate (183C to peak) Preheat Temperature 125(25)C to 200C Temperature maintained above 220C Time within 5C of actual peak temperature Peak temperature range Ramp down rate Time 25C to peak temperature 3C/sec max 60-180C 60-150 sec 20-40 sec 260 5C 6C/sec max 8min max
Note: Surface Mount Adhesives (SMA) isn't recommended to be used on the dome area (white dome).
(c) 2004 Fairchild Semiconductor Corporation
Page 7 of 8
8/19/04
SINGLE CHANNEL MICROCOUPLERTM FODB100 FODB101 FODB102
DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. 2. A critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.
(c) 2004 Fairchild Semiconductor Corporation
Page 8 of 8
8/19/04

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